Taiwan No.1 in wafer capacity but China closing the gap

Taiwan has the largest installed base for IC wafer capacity, says IC Insights, edging out Korea in second place.

This article was posted on Jul 9, 2020

Infineon and Blumio to develop wearable radar-based blood pressure sensor

Infineon’s Silicon Valley Innovation Center (SVIC) has agreed with cardiovascular monitoring specialist Blumio to co-develop a wearable, non-invasive blood pressure sensor based on Infineon’s XENSIV radar chipset by 2021.

This article was posted on Jul 9, 2020

100V half-bridge driver updates ISL2111

Renesas has introduced a pair of 100V half-bridge mosfet gate drivers.

This article was posted on Jul 9, 2020

LoraWAN for tracking personal assets

Smart Mimic has integrated Semtech’s LoRa devices and the LoRaWAN protocol into its MimicGO line of consumer products for securing rooms and belongings.

This article was posted on Jul 9, 2020

Battery balancing IC measures voltage in 12 cells

Infineon has come out with a sensing and balancing IC for Hybrid and EV car batteries.

This article was posted on Jul 9, 2020

Huawei gets planning permission for $1bn Cambridgeshire R&D facility

South Cambridgeshire District Council has given Huawei planning permission to build a $1 billion R&D facility in Sawston village.

This article was posted on Jul 9, 2020

Government to buy 20% of OneWeb satellite system

The government is reported to be proposing to spend $500 million buying 20% of OneWeb, the bankrupt satellite company.

This article was posted on Jul 9, 2020

Royal Society takes its Summer Science Exhibition online

This year, in the wake of Covid-19, the Royal Society’s Summer Science Exhibition is going online.

This article was posted on Jul 9, 2020

Virgin Galactic completes second test flight of SpaceShipTwo

Virgin Galactic has successfully completed the second SpaceShipTwo test flight from Spaceport America, in the Jornada del Muerto desert basin in New Mexico.

This article was posted on Jul 9, 2020

Tsinghua Unigroup to start on DRAM fab this year

Tsinghua Unigroup is to break ground on a DRAM fab this year, according the the Nikkei,

This article was posted on Jul 9, 2020

Siemens buys UltraSoC

Siemens is to buy UltraSoC and integrate its technology into the Xcelerator portfolio of Mentor’s Tessent software product suite.

This article was posted on Jul 8, 2020

Softbank to sell stake in T-Mobile

Softbank is to sell its stake in T-Mobile following T-Mobile’s purchase of Softbank’s US telco Sprint earlier this year.

This article was posted on Jul 8, 2020

Renesas introduces magnet-free inductive position sensor

Renesas has introduced the magnet-free IPS2200 inductive position sensor.

This article was posted on Jul 8, 2020

Mil spec 28Vin 1kW PSU with multiple outputs

Vicor is aiming at VPX conduction-cooled chassis in avionics and ships with a 1kW multi-output PSU that runs from a 28V dc rail.

This article was posted on Jul 8, 2020

Toshiba adds super junction n-channel power MOSFETs

Toshiba has introduced eight super junction N-channel power MOSFETs to strengthen its DTMOSVI series.

This article was posted on Jul 8, 2020

Hermetic LVDT displacement sensor for tough contaminated environments

NewTek’s HATR series of ac-operated LVDT displacement sensors are hermetically-sealed for use in tough contaminated environments such as pulp and paper mills.

This article was posted on Jul 8, 2020

Lattice puts fast I/O on low-power FPGA for IoT edge

Lattice Semiconductor has released the second family of devices developed from its Nexus 28nm FDSoI platform, equipping them with fast PCI Express (PCIe) and Gigabit Ethernet interfaces for co-processing, signal bridging, and system control.

This article was posted on Jul 8, 2020

Zebra acceleration for Xilinx’s Alveo card

Mipsology, which specialises in deep learning acceleration software, has had its Zebra neural net accelerating software integrated into the latest build of Xilinx’s Alveo U50 data centre accelerator card.

This article was posted on Jul 8, 2020

IEDM 2020 to be virtual

The organizers of the upcoming 66th annual IEEE International Electron Devices Meeting (IEDM) have decided to hold the conference virtually this year given the ongoing uncertainties posed by the prevailing COVID-19 pandemic.

This article was posted on Jul 8, 2020

Tuya joins Zigbee Alliance Board for Project Connected Home over IP

IoT specialist Tuya is the latest company to join the Zigbee Alliance Board of Directors, to help steer the low-power wireless comms standard.

This article was posted on Jul 8, 2020

Leti makes CMOS at 500°C for 3D sequential chips

CEA-Leti scientists have made FDSOI CMOS at 500°C, “while showing strong performance gains especially in p-type MOS logic devices”, according to the French lab, which has branded the process ‘CoolCube’.

This article was posted on Jul 7, 2020